Target arrangement with a circular plate, magnetron for mounting the target arrangement, and process for coating a series of circular disc-shaped workpieces by means of said magnetron source
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
May 30, 2000
Grant Date -
N/A
app pub date -
Aug 23, 1996
filing date -
Jul 22, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A target arrangement for a sputtering apparatus has a circular plate target with either a circumferential protrusion or recess which is symmetrical about a central plane through the target, the plane being perpendicular to the central axis of the target and located halfway between the top and bottom surfaces of the target. Each surface of the target is composed primarily of sputtering material. A magnetron for use with the target arrangement for easy changing of the target to sputter using the opposite surface of the target is disclosed. A process for using the target arrangement and magnetron assembly to sputter a work piece is also disclosed.
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