Pad tape surface polishing method and apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 30, 2000
Grant Date -
N/A
app pub date -
Jun 25, 1997
filing date -
Jul 24, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A surface polishing method comprises allowing a holder to hold a flat sheet-like workpiece, placing a pad tape in a location opposite to the holder, the pad tape consisting of a tape substrate and grains bonded to the substrate surface, supplying free grains between the holder and the pad tape, and rotating the holder and/or a mechanism holding the tape, thereby causing the free grains to polish the workpiece. An apparatus for practicing the method comprises a holder capable of holding a flat sheet-like workpiece, a tape holding mechanism located opposite to the surface of the workpiece and carrying a pad tape which consists of a tape substrate and grains bonded to the substrate, a rotary mechanism for rotating the holder and/or the tape holding mechanism, and an abrasive supplying mechanism for supplying free grains between the surface of the workpiece and the pad tape. The apparatus may further comprise a tape conveying mechanism for feeding the pad tape intermittently and/or a rocking mechanism for rocking the holder or the tape holding mechanism. The rotary mechanism maybe designed to cause eccentric motion or planetary motion of the holder.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TOMOE ENGINEERING CO LTD A JAPANESE CORP | DAINI MARUZEN BUILDING 9-2 NIHONBASHI 3-CHOME CHUO-KU TOKYO | |
SANSHIN CO LTD A JAPANESE CORPORATION | 1-11 HEIJIMA NAGAOKA-SHI NIIGATA-KEN |
International Classification(s)

- 1997 Application Filing Year
- B24B Class
- 606 Applications Filed
- 279 Patents Issued To-Date
- 46.04 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hosokai, Nobukazu | Nagaoka, JP | 4 | 58 |
# of filed Patents : 4 Total Citations : 58 |
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Patent Citation Ranking
- 51 Citation Count
- B24B Class
- 98.78 % this patent is cited more than
- 25 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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