Over-voltage protection system for integrated circuits using the bonding pads and passivation layer
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United States of America Patent
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May 16, 2000
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N/A
app pub date -
Mar 10, 1998
filing date -
Mar 10, 1998
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Abstract
A protection system for integrated circuits which prevents inadvertent damage caused by over-voltage power surges by extending the passivation layer of an integrated circuit over the bonding pads and placing a ground plane over that passivation layer so as to create an over-voltage switching element out of that combination.
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