Heat sink

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United States of America Patent

PATENT NO 6062299
SERIAL NO

08996014

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Importance

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Abstract

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A heat sink comprising: a body having an envelope including a flexible portion for thermal contact with a heat source, the envelope being filled with a thermally conductive liquid; and a thermosyphon having one end disposed at least partly within the liquid in the body to absorb heat from the heat source and another end disposed outside the envelope to dissipate heat.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
DSO NATIONAL LABORATORIES20 SCIENCE PARK DRIVE SINGAPORE 118230

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Weng Kong 39 Carpmael Road, Singapore 429782, SG 2 41
Choo, Kok Fah Blk 428 Bedok North Rd. #10-617, Singapore 460428, SG 2 41
Liu, Chang Yu Head Counselor Residence, Hall 4 Nanyang Drive, Singapore 639788, SG 3 45
Tou, Kwok Woon 4 Rifle Range Road #05-02, Singapore 58837, SG 2 41
Wong, Yew Wah 26 Jalan Merah Saga, Singapore 278105, SG 2 41

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