Method for protecting substrates
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United States of America Patent
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-
May 9, 2000
Issued Date -
N/A
app pub date -
Dec 19, 1997
filing date -
Oct 27, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A tape covering for elongate substrates such as metal pipes is provided. At least one edge of the tape is chamfered. and in preferred embodiments the angle of the chamfer is no greater than 25.degree. especially no greater than 7.degree.. In other preferred embodiments the tape comprises a backing layer and an adhesive layer, both of which preferably include a chamfered edge, the chamfer preferably extending through both the backing layer and the adhesive layer. The tape is preferably heat recoverable, and the adhesive, if present, heat activatable. The tape may be installed according to a preferred method of the invention using induction heating, preferably at such high frequency that the ratio of the thickness of the substrate to the skin depth is at least 25:1.
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