Importance

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Abstract

The present invention provides methods and apparatus capable of efficiently combining a logic circuit die with a memory circuit die in a single integrated circuit device capable of supporting memory intensive applications, such as 3-dimensional graphics rendering, encryption and signal processing. The logic circuit die is produced independently with a logic circuit fabrication process that optimizes the logic circuit's performance and reduces costs, and the memory circuit die, which may contain a large memory circuit, can be produced independently with a memory circuit fabrication process that optimizes the memory circuit's performance and reduces costs. The circuit dies are attached directly together in a flip-chip fashion to create a unitary integrated circuit assembly having a high-performance, low impedance, wide-word interface. This integrated circuit assembly can be enclosed within a typical integrated circuit package for insertion on a circuit board, such as those used in personal computers and other common electronic applications.

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First Claim