Method for bonding a ceramic to a metal with a copper-containing shim
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United States of America Patent
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May 2, 2000
Issued Date -
N/A
app pub date -
Jul 9, 1997
filing date -
Jun 25, 1996
priority date (Note) -
Expired
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Abstract
A method is provided for the bonding of ceramics to metals for the production of semiconductor packages. The method includes forming a copper-copper oxide eutectic on a substantially planar copper shim. The shim and its copper-copper oxide eutectic are placed in contact with a ceramic layer and metal layer. The assembly, so formed, is then heated to a temperature at least equal to the melting point of the eutectic and no greater than the melting temperature of copper. Upon cooling of the eutectic, a bond forms bond the ceramic layer to the metal layer.
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