Electrical apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 18, 2000
Grant Date -
N/A
app pub date -
Aug 18, 1999
filing date -
Jul 11, 1996
priority date (Note) -
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Abstract
A semiconductor switch die (30) is mounted on one face of a substrate (31) and has a temperature sensor (10) on the opposite face to monitor the temperature in the vicinity of the semiconductor die. A current sensor (4) and voltage sensor (5) supply signals to a processor (15) to calculate power dissipated by the semiconductor device. The processor calculates the temperature of the device itself from the measured temperature and the dissipated power. If this exceeds a preset limit, the switching device is opened to prevent damage.
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