Apparatus and method for rapid thermal processing (RTP) of a plurality of semiconductor wafers
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United States of America Patent
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Apr 18, 2000
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N/A
app pub date -
Apr 11, 1997
filing date -
Apr 11, 1997
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Abstract
A plurality of substrates is closely stacked together in a Rapid Thermal Processing (RTP) chamber, and the stack is processed simultaneously.
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