Importance

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Abstract

A device for the chemical-mechanical polishing of the surface of an object, in particular of semiconductor wafers for the manufacture of semiconductors, with two polishing units with height-adjustable vacuum holders each for a semiconductor wafer, which can be driven by a drive motor about a vertical axis, parallel, approximately horizontally running guides, along which the polishing units are guided independently of one another, drive means by which the polishing units are moved along the guides, at least one polishing plate rotatingly driven below the guides, which is arranged approximately symmetrically on both sides of the longitudinal axes of the guides, by which means the polishing units in their corresponding operational position cooperate with oppositely lying sections of the polishing plate, at least one transfer and take-over device for the semiconductor wafer, at the end of the guides which is opposite to the polishing plate, two depositing and accommodating devices for the semiconductor wafer, which are arranged on oppositely lying sides of the guides and to which the polishing units can be aligned and which can be reached from the transfer and take-over device and a control device which controls the operation of the polishing units and of the transfer and take-over device.

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First Claim