Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package
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United States of America Patent
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Apr 11, 2000
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app pub date -
Jun 15, 1994
filing date -
Jul 21, 1990
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Abstract
A process for manufacturing a package of a semiconductor device, and providing a semiconductor device in which a vapor-impermeable moistureproof plate is embedded in a bottom surface of a hollow package or an inner surface wallthicknesswise therefrom to provide moisture-proofness.
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