Phenolic hydroxyl-containing resin by reacting epoxy resin with excess difunctional phenol and epoxidation thereof

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United States of America Patent

PATENT NO 6046284
SERIAL NO

09029346

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Abstract

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A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above. ##STR1##

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Patent Owner(s)

Patent OwnerAddress
KUKDO CHEMICAL CO LTD345-35 GASAN-DONG GEUMCHEON-GU SEOUL

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hanafusa, Masayoshi Edogawa-ku, JP 5 8
Nozawa, Hidenori Edogawa-ku, JP 2 7
Saitoh, Nobuhisa Edogawa-ku, JP 3 23
Shinohara, Shuya Edogawa-ku, JP 5 46
Takeda, Yasuyuki Edogawa-ku, JP 25 153

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