Test socket for electronic module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 4, 2000
Grant Date -
N/A
app pub date -
Oct 2, 1997
filing date -
Oct 2, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A socket for establishing a releasable connection between terminals of electronic modules and a circuit board includes a base having a module support surface for supporting the module in test position. A contact holder cooperates with the base for supporting contact elements for each terminal of the module. Each of the contact modules include a projecting portion projecting from the socket and before engagement with the circuit board, a support section which is supported on the contact holder in grooves defined between ribs and oriented with respect thereto by tabs on the contact elements engaging gaps in the grooves, and a deflecting section which extends over slots in the contact holder. When a module to be tested, the module is placed on the test surface and a lid pivotally mounted on the socket is closed to thereby push the terminals into engagement with the contact elements and thereafter downward force being accommodated by deflection of the deflectable portion of the contact elements into the grooves. A heat sink carried by the socket drains thermal energy from the module.
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