Thermal connecting structure for connecting materials with different expansion coefficients
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United States of America Patent
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Mar 28, 2000
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N/A
app pub date -
Nov 7, 1997
filing date -
Nov 11, 1996
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Abstract
A connecting structure (23) for establishing a thermal connection between at lest two components (21, 22) composed of materials with different expansion coefficients, wherein at least one component forms an electronic power element (21) and higher-melting-point materials are used for the contacting, which higher-melting-point materials form isolated connecting elements (29) between the contact surfaces (27, 28) of the components (21, 22).
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