Thick film elements
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 28, 2000
Grant Date -
N/A
app pub date -
May 9, 1997
filing date -
Nov 26, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thick film resistive heating element having a thick film resistive track applied to the surface of an electrically insulative substrate. An encapsulating insulating layer is applied over the track to protect it while an area of the element is left uncovered by the encapsulating layer so as to define a window. A portion of a temperature sensitive control device is then placed in direct contact with the track and/or the electrically insulative substrate through the window. The window in the element is located in that area of the element which will be uncovered by the liquid prior to the rest of the element as the liquid boils away or is evacatuated from the vessel.
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