Microsphere containing circuit board paper
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United States of America Patent
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Mar 28, 2000
Grant Date -
N/A
app pub date -
Sep 23, 1997
filing date -
Sep 23, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.
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