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Abstract

An electronic part having a complicated internal configuration is integrally molded without dividing the configuration into a plurality of sections, thereby reducing the cost and improving the quality of the electronic part. The manufacturing process comprises producing a core to be used in the subsequent injection molding, which corresponds to the complicated internal configuration of the electronic part, by the injection molding of a polyvinyl alcohol-based resin containing an oxyalkylene group, producing a second stage product which has the core inserted therein and which has a ridgy projection as a circuit pattern forming area on the surface thereof by the injection molding of a metallization-grade aromatic polyester liquid crystalline polymer, immersing the second stage product in hot water under heating so as to dissolve the core away in hot water, roughening the surface of the second stage product and then providing a catalyst thereto so as to produce a third stage product, inserting the third stage product into a mold cavity and then injecting a nonmetallization-grade liquid crystalline polymer into the mold cavity encircling the third stage product by injection molding so that the surface excluding the ridgy projection as a circuit pattern forming area is coated with the liquid crystalline polymer so as to obtain a fourth stage product, and finally metallizing the surface of the circuit pattern forming area exposed on the external peripheral surface of the fourth stage product so as to form an electrically conductive circuit.

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First Claim