Crack stops
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United States of America Patent
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Feb 15, 2000
Issued Date -
N/A
app pub date -
Apr 16, 1998
filing date -
Mar 24, 1997
priority date (Note) -
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Abstract
Crack stops for substantially preventing cracks and chips produced along the dicing channel from spreading into the active areas of the ICs are described. The crack stops are formed by creating discontinuities in the thickness of the dielectric layer in the dicing channel near the chip edges. The discontinuities can result in increasing and/or decreasing the thickness of the dielectric layer.
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