Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit
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United States of America Patent
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Feb 8, 2000
Issued Date -
N/A
app pub date -
Feb 18, 1998
filing date -
Sep 20, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.
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