Low density polymers and methods of making and using same
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United States of America Patent
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Feb 1, 2000
Grant Date -
N/A
app pub date -
Sep 22, 1997
filing date -
Sep 22, 1997
priority date (Note) -
Expired
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Abstract
A low density polymer composition including a polymer component capable of being cured, a low density filler in an amount sufficient to reduce the density of the polymer and a thixotrope present in a sufficient amount to impart a sufficient viscosity and to inhibit separation of the filler from the polymer until after the polymer is cured. The resulting lightweight, filled polymer composition is a strong electrical insulator, has low shrinkage, a low coefficient of thermal expansion, low cured density and a soft filler that does not harden the polymer. Methods of preparing and using the low density polymer compositions are also disclosed.
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