Air blow apparatus for a semiconductor wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 1, 2000
Grant Date -
N/A
app pub date -
Jun 30, 1997
filing date -
Jun 29, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An air blow apparatus peels wafers off and simultaneously removes grease and grindstone grains by blowing air into gaps formed between semiconductor wafers sliced by a wire saw from a semiconductor ingot. Two injection nozzles 1a, 1b are symmetrically mounted at predetermined positions with respect to the central line c of the semiconductor wafer 10. Air injections 11a, 11b are injected from the outer top of the semiconductor wafer 10. Injection nozzles 1a, 1b are arranged so that they are movable in the longitudinal direction of the semiconductor ingot. Air injections 11a, 11b are set to be blown out at a cone shape of about 30 degrees.
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