Resin composition to be plated
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United States of America Patent
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-
Jan 25, 2000
Issued Date -
N/A
app pub date -
May 5, 1997
filing date -
Mar 29, 1995
priority date (Note) -
Expired
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Abstract
A resin composition for plating comprising a thermoplastic resin and aluminum borate or amorphous silica, or both as an inorganic filler. The resin compositionexhibits excellent plating characteristics and excellent electrical characteristics.
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