Method of forming a plating layer of a lead frame
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United States of America Patent
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-
Jan 25, 2000
Grant Date -
N/A
app pub date -
Oct 17, 1997
filing date -
Oct 18, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for forming a plating layer of a lead frame having excellent anti-corrosion properties is provided. At least a portion of a lead frame is plated, then a first heating of the plated portion of the lead frame to a first temperature is performed, and finally a second heating of the first heated plated portion of the lead frame to a second temperature higher than the first temperature is performed. The lead frame manufactured by this method has excellent anti-corrosion properties, such that deterioration of the plating layer, by cracking and inferior solderability, is not observed.
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