Process for producing electronic parts

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United States of America Patent

PATENT NO 6015523
SERIAL NO

08993020

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Abstract

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An electronic part, which has a complicated internal configuration and has a movable part rotatably and movably accommodated therein, is integrally molded without dividing the configuration into a plurality of sections to carry out a number of molding operations for separate sections of the electronic part, thereby reducing the cost and enhancing the quality of the electronic part. The manufacturing process comprises producing a core for the injection molding by the injection molding of a polyvinyl alcohol-based resin containing an oxyalkylene group, producing a second stage product, which has the core inserted therein so as to be partly exposed, by the injection molding of a metallization-grade aromatic polyester liquid crystalline polymer, which contains a catalyst, producing a third stage product so that the second stage product is partly exposed by the injection molding of a nonmetallization-grade aromatic polyester liquid crystalline polymer, immersing the third stage product in hot water so that the core is dissolved in hot water, etching the surface of the circuit pattern forming area, which is exposed on the surface and is made from the metallization-grade polymer, and then metallizing the etched surface so that an electrically conductive circuit is formed thereon. In the above-described process, the movable part is embedded in the core.

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Patent Owner(s)

Patent OwnerAddress
SANKYO KASEI KABUSHIKI KAISHAOTA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yumoto, Tetsuo Saitama, JP 14 122

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