Fluorinated fluxless soldering
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 11, 2000
Issued Date -
N/A
app pub date -
Sep 15, 1997
filing date -
Dec 6, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for pretreating a solder surface for fluxless soldering is disclosed. The method uses a noble fluorine gas to remove surface oxides from solder surfaces, without the use of external stimulation. A noble fluorine gas is suffused across the solder surface to reduce or eliminate or chemically convert the surface oxides. The process can take place at atmospheric pressure and room temperature. A simple belt driven transport may be used to move the parts past a nozzle which emits the vapor in a system similar to a conventional solder reflow machine.
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