Device and method for cutting semiconductor-crystal bars
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United States of America Patent
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Dec 28, 1999
Grant Date -
N/A
app pub date -
Jan 29, 1998
filing date -
Jan 29, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A plurality of wires are stretched in parallel through wire supplying-winding apparatuses and wire-tension adjusting apparatuses. A semiconductor-crystal bar is affixed on an ascent/descent table via a feeding table. The ascent/descent table is capable of being driven to ascend or descend by the ascent/descent apparatus. The wires and the semiconductor-crystal bar are dipped into a high-insulation oil, and discharging is created therebetween to perform cutting. If the resistance of the semiconductor-crystal bar exceeds 1 .OMEGA..multidot.cm, used inert gas is filled into a space within the interior space of an airtight vessel. Then, the high-insulation oil is heated by heaters and is kept at a temperature higher than 150.degree. C. to reduce the resistance of the semiconductor-crystal bar. Therefore, cutting is easily performed. The used inert gas can prevent fire from occurring due to the flaming of the high-insulation oil.
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