Heat protective enclosure and heat protected electronic device
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United States of America Patent
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-
Dec 14, 1999
Grant Date -
N/A
app pub date -
May 14, 1998
filing date -
May 17, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
In a high-temperature protective arrangement for an electronic device, which as such generates heat, the electronic device is enclosed by a heat protective enclosure provided with gaps for permitting heat removal by air convection. The heat protective enclosure is coated with a material which is subject to swelling under the action of heat to a multiple of the thickness of the original coating whereby a heat-insulating layer is formed and the gaps are closed. Electronic components of the electronic device are disposed within a housing. The heat generated by the electronic components is passed to the housing which is surrounded at a spacing substantially on all sides by the heat protective enclosure.
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