Recovery of coolant and abrasive grains used in slicing semiconductor wafers
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United States of America Patent
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Dec 14, 1999
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N/A
app pub date -
Feb 14, 1997
filing date -
Feb 21, 1996
priority date (Note) -
Expired
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Abstract
A system for reusing water soluble slurry waste fluid wherein separated available abrasive grains and extracted water soluble coolant are reused. This system is capable of reducing a disposal cost due to a reduction of a load to a waste water disposal plant by effectively reusing water soluble slurry waste fluid, and making a contribution to a reduction of a total slicing cost by reusing abrasive grains and water soluble coolant.
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