Interconnect system for intergrating a bussed electrical distribution center with a printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 14, 1999
Grant Date -
N/A
app pub date -
Sep 29, 1998
filing date -
Sep 29, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated BEDC and PCB provided through a low cost, highly reliable interconnect system. The upper and/or lower half of the main insulation assembly of a BEDC is provided with a recess for accommodating at least an edge portion of the substrate of a PCB. The PCB is provided with apertures such as holes for receiving therethrough a buss wire and/or terminal slots through which terminals having wire slots are fixedly staked. The apertures on the PCB are arranged in a predetermined pattern so as to align with corresponding respective apertures in the form of corresponding holes and/or terminal slots on the BEDC at the recess thereof. Accordingly, with the PCB seated in the recess, as the buss wires are laid, they will pass through the holes in the PCB and/or pass through the wire slot of the terminals and thereby provide interconnection therebetween when the two halves of the main insulation assembly are united and the PCB is sandwiched therebetween.
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