Process for deposition of layered coatings on copper and alloys thereof
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United States of America Patent
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Dec 7, 1999
Grant Date -
N/A
app pub date -
Jul 14, 1998
filing date -
Jul 16, 1997
priority date (Note) -
Expired
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Abstract
A process for the deposition of thick coatings with a thickness >1 mm on products made of copper or alloys thereof, wherein said products are subjected to the following operations: surface activation of the product made of copper or alloys thereof; optional heat stabilization to a temperature below the ones causing deterioration of the chemical and physical properties of the copper or alloys thereof; deposition of a first layer, for example of Ni or alloys thereof; optional interdiffusion heat treatment; optional activation of the surface of the first layer; thermal stabilization of said product at a temperature of between 20.degree. and 400.degree. C.; deposition of one or more intermediate layers of at least one of the following: Al; AlSi; Cu; Ni; NiAl; NiCr; NiCu; MCrAlY (wherein M can be Ni, Co, Fe or mixtures thereof), mixtures thereof, or mixtures of said intermediate layers with said thick coating; thermal stabilization of the product coated with said intermediate layers at a temperature of between 20.degree. and 300.degree. C.; and deposition of said thick coating on the product coated with said intermediate layers.
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