Gold-based alloy for bonding wire of semiconductor device
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United States of America Patent
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Nov 30, 1999
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N/A
app pub date -
May 29, 1998
filing date -
May 29, 1998
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Abstract
The present invention relates to an alloy for bonding wire used to connect a semiconductor chip and a lead frame and, more particularly, to a gold-based alloy for bonding wire of a semiconductor device which is excellent in the strengths at room temperature and under hot conditions after bonding, capable of controlling the ball size to be smaller in bonding, and preventive of a short between wires, the gold-based alloy for bonding wire of a semiconductor device being characterized by containing 0.5 to 5.0 wt. % of Pd, 5 to 50 wt.PPM of Ba, each 1 to 10 wt.PPM of at least one selected from the group consisting of Be and Ca, and Au for the rest, thereby having excellent strengths at room temperature and under hot conditions after bonding, controlling the size of a ball smaller, and preventing a short between wires.
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