Sawing machine and sawing processing method for a plate member

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United States of America Patent

PATENT NO 5992485
SERIAL NO

09100566

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Abstract

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A workpiece processing apparatus for processing a predetermined plate member and a sawing process method therefor. A workpiece processing apparatus which includes a workpiece mounting assembly for receiving a workpiece; a tool assembly having a tool mounting element configured for rotational and reciprocal motion, the tool assembly positioned adjacent to the workpiece mounting assembly; the workpiece mounting assembly being movable relative to said tool assembly to position the tool mounting element adjacent the workpiece; and a tool positioned in said tool mounting element and defining a longitudinal axis, said tool having a drilling portion and a cutting portion. A method for processing a workpiece which includes the steps of providing a workpiece processing apparatus capable of performing a drilling function and a sawing function; placing the workpiece on a workpiece mounting assembly of the workpiece processing apparatus; positioning a drilling assembly of the workpiece processing apparatus above a predetermined location on the object; rotating the drilling assembly to drill a hole through the workpiece; chucking the tool after it passes through the hole drilled in the workpiece; reciprocating the tool to cut a portion of the workpiece; and moving the workpiece mounting assembly to thereby move and cut the workpiece based on a predetermined set of data.

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Patent Owner(s)

Patent OwnerAddress
SEOUL LASER DIEBOARD SYSTEM CO LTD13 HEUNGAN-DAERO 49 BEON-GIL DONGAN-GU ANYANG-SI GYEONGGI-DO
SEOUL LASER DIEBOARD SYSTEM CO LTD27171 BURBANK FOOTHILL RANCH CA 92610

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Song, Byung-Jun Kwangmyung, KR 23 91

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