Sawing machine and sawing processing method for a plate member
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United States of America Patent
Stats
-
Nov 30, 1999
Grant Date -
N/A
app pub date -
Jun 19, 1998
filing date -
Jun 19, 1998
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A workpiece processing apparatus for processing a predetermined plate member and a sawing process method therefor. A workpiece processing apparatus which includes a workpiece mounting assembly for receiving a workpiece; a tool assembly having a tool mounting element configured for rotational and reciprocal motion, the tool assembly positioned adjacent to the workpiece mounting assembly; the workpiece mounting assembly being movable relative to said tool assembly to position the tool mounting element adjacent the workpiece; and a tool positioned in said tool mounting element and defining a longitudinal axis, said tool having a drilling portion and a cutting portion. A method for processing a workpiece which includes the steps of providing a workpiece processing apparatus capable of performing a drilling function and a sawing function; placing the workpiece on a workpiece mounting assembly of the workpiece processing apparatus; positioning a drilling assembly of the workpiece processing apparatus above a predetermined location on the object; rotating the drilling assembly to drill a hole through the workpiece; chucking the tool after it passes through the hole drilled in the workpiece; reciprocating the tool to cut a portion of the workpiece; and moving the workpiece mounting assembly to thereby move and cut the workpiece based on a predetermined set of data.

First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SEOUL LASER DIEBOARD SYSTEM CO LTD | 13 HEUNGAN-DAERO 49 BEON-GIL DONGAN-GU ANYANG-SI GYEONGGI-DO | |
SEOUL LASER DIEBOARD SYSTEM CO LTD | 27171 BURBANK FOOTHILL RANCH CA 92610 |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Song, Byung-Jun | Kwangmyung, KR | 23 | 91 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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