Laminated multilayer substrates
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United States of America Patent
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Nov 16, 1999
Issued Date -
N/A
app pub date -
Jul 14, 1998
filing date -
Feb 13, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multilayer package includes a plurality of interconnected large-layer-count (LLC) substrates. The LLC substrates each include conductive pads on the top and bottom surfaces of the substrate, a via in the substrate including conductive material to contact the pads on the top and bottom surfaces, and a post on a pad over the via. The posts of the substrates confront and abut each other, and are electrically bonded together. A non-flowable adhesive film mechanically bonds the LLC substrates, and has an aperture receiving the posts of the substrates.
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