Tapered structure suitable for microthermocouples microelectrodes, field emission tips and micromagnetic sensors with force sensing capabilities
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United States of America Patent
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Nov 16, 1999
Grant Date -
N/A
app pub date -
Oct 29, 1997
filing date -
Apr 29, 1996
priority date (Note) -
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Abstract
A tapered, nonconductive structure (10) having a hollow core (18) and a conical tip (14) includes a metal wire (16) within the core (18). The wire (16) is sealed within, and is exposed at the end (22) of, the tip (14). An electrically conductive or semiconductive layer (24) on the exterior of the tip (14) form a point thermocouple contact with the wire. The tip (14) may be fabricated, for example, by placing a metal wire (16) within a tube (12), and heating and pulling the tube (12) to produce two tapered micropipettes. Thereafter, a thin metal or semiconductor film (24) is evaporated onto the outer surface.
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