High strength lead-free solder materials

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United States of America Patent

PATENT NO 5985212
SERIAL NO

08764293

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Abstract

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Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.01 and 9.5 weight percent Cu, between about 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.5 and 6.5 weight percent Ag, between 0.5 and 8.0 weight percent Bi, and optionally including one or more of the following elements: between 0.1 and 10.0 weight percent In, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.1 and 0.8 weight percent Ag, between 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 1.0 weight percent, Ga in an amount of not greater than 1.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent.

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Patent Owner(s)

Patent OwnerAddress
SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE LTE47 PANDAN ROAD SINGAPORE 609288 60928

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwang, Jennie S Moreland Hills, OH 14 254
Koenigsmann, Holger J Oakwood, OH 15 266

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