Test head for integrated circuits
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United States of America Patent
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Nov 9, 1999
Grant Date -
N/A
app pub date -
Sep 2, 1997
filing date -
Dec 19, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A test head is used in an electrical characteristic test of a plurality of integrated circuits formed on a semiconductor wafer. The test head includes a probe holder in a frame form for holding a plurality of first probes and supporting bodies in a plate form for supporting a plurality of second probes. The probe holder is disposed on a base plate such that the first probes are brought into contact with pads disposed at a portion corresponding to the edge portion defining an opening formed in the base plate. The supporting bodies are attached to the base plate with the direction of their thickness oriented in the lengthwise direction of the opening in the base plate in order that the second probes are brought into contact with pads existing at the boundary portions of a plurality of integrated circuits to be tested at a time and disposed at the portions corresponding to the adjoining sides of the integrated circuits.
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