Power semiconductor module with closed submodules
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 9, 1999
Grant Date -
N/A
app pub date -
Jun 23, 1998
filing date -
Jun 23, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention discloses a power semiconductor module 10 having encapsulated submodules 1 which, for example, is suitable for power switches, rectifiers for the like in industrial or traction drives. The submodules 1 have a sandwiched structure made up of a ceramic substrate, one or a few power semiconductor chips and a molybdenum wafer, and are potted in plastic. They are held in plug-in locations 19 on a common baseplate 11 and make contact via a stack arrangement of conductors 12, 14, 18. Retention and contact of the submodules 1 take place reversibly via pressure contacts 15, 16, 20, clamp contacts 21 or the like. Important advantages of the power semiconductor module 10 relate to the simple and easily scaleable structure, improved ability to withstand thermal load cycles, and the robustness and easy interchangeability of the submodules.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully