Power semiconductor component with a pressure-equalizing contact plate
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United States of America Patent
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Nov 2, 1999
Grant Date -
N/A
app pub date -
Jul 17, 1998
filing date -
Jul 30, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention discloses a power semiconductor component 1 having a special pressure contact system which is suitable, for example, for circuit-breakers, rectifiers, or the like in industrial drives. A pressure-equalizing element 9 in the form of a box 10, 15 with a flowable or plastically deformable medium 12 is inserted between a pressure plunger 7a and a power semiconductor 2. Because of the hydrostatic pressure in the box 10, an inhomogeneous pressure delivered at one side is passed on to the other side as a homogeneous pressure. A homogeneous pressure delivery can be achieved, even in the edge region of the pressure surfaces 11a, 11b, by means of an inlet camber of the lateral surface 13. The box 10, 15 preferably consists of copper or AlSiC, and the medium 12 of a liquid metal (Ga, Hg), a plastic metal (Pb, Al) or of metal balls (Cu) in silicone oil. The box can be arranged on one or both sides of one or more power semiconductors 2, and can also replace the molybdenum disks 3a, 3b or contact plates 4a, 4b.
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