Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe
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United States of America Patent
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Oct 26, 1999
Grant Date -
N/A
app pub date -
Jan 4, 1999
filing date -
Jan 26, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
In order to package an electronic component, a leadframe is provided having at least one flag portion (2) and at least one lead portion (7) extending towards the flag portion (2). The lead portion (7) includes an end portion (10) of reduced thickness adjacent the flag portion (2) and a channel (9) between the end portion (10) and the rest of the lead portion. The leadframe is etched to form the channel (9) and the end portion(10), which together form a locking step. The electronic component (3) is then mounted on the flag portion (2) and electrically connected to the end of the lead portion (7). The electronic component (3), the electrical connection (5), at least the end portion (10) and the intermediate portion (9) of the lead portion (7) and at least part of the flag portion (2) are encapsulated in a plastics molding compound, which enters and fills the locking step, and is then cured.
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