Gasket for use in a container
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United States of America Patent
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-
Oct 26, 1999
Grant Date -
N/A
app pub date -
Feb 14, 1997
filing date -
Apr 27, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A container for packing semiconductor wafer is provided which has superior airtightness to prevent contamination of the wafers by air. A gasket groove is formed on the case of the container. A gasket is inserted within the gasket groove. The gasket contains protrusions that assist in providing an airtight seal. The case and a lid are securely fastened together by the engagement of four clips within respective clip recesses that are formed in the container and lid.
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