Ball grid array semiconductor package
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United States of America Patent
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Oct 19, 1999
Grant Date -
N/A
app pub date -
Sep 18, 1998
filing date -
Sep 19, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A ball grid array semiconductor package including a semiconductor chip, at least one lead having one end attached to the semiconductor chip and other end bent at a predetermined angle, a wire connecting the bent lead to an electrode formed on the semiconductor chip, a first bump attached to a bent end portion of the bent lead, and a resin molding enclosing the semiconductor chip, the lead and the wire to allow one side surface of the bump to be exposed out of the resin molding.
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