Method of modifying an exposed surface of a semiconductor wafer
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United States of America Patent
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Sep 28, 1999
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N/A
app pub date -
Aug 8, 1996
filing date -
Sep 22, 1995
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Abstract
A method of modifying an exposed surface of a semiconductor wafer that includes the steps of: (a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abrasive particles and a binder in the form of a pre-determined pattern; and (b) relatively moving the wafer and the fixed abrasive article to modify said surface of the wafer.
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