Process of making interposers for land grip arrays
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United States of America Patent
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-
Sep 21, 1999
Grant Date -
N/A
app pub date -
Jul 16, 1997
filing date -
Jul 16, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An interposer is formed by forming a laminate comprising a first sheet of electrically insulating material and a second sheet of conductive material. The first sheet has a first plurality of apertures therethrough and the second sheet is laminated to the first sheet to close the first plurality of apertures. Material is removed from the second sheet around the first plurality of apertures to form conductive pads, the pads closing the first plurality of apertures. A third sheet of electrically insulating material is attached to the second sheet. The third sheet has a second plurality of apertures therethrough, the third sheet being positioned relative to the second sheet such that the apertures of the second plurality are closed by the conductive pads. In a preferred form, the third sheet is positioned relative to the first sheet so that the apertures of the second plurality are not in registration with the apertures of the first plurality.
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