Ceramic-polymer composite material and its use in microelectronics packaging
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United States of America Patent
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Aug 31, 1999
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N/A
app pub date -
Oct 15, 1997
filing date -
Oct 15, 1997
priority date (Note) -
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Abstract
A ceramic-polymer composite material such as part of a microelectronics package is formed of a ceramic mixture of aluminum nitride and boron nitride, and a low-loss polymeric material. The amount of aluminum nitride is preferably from about 50 to about 90 weight percent of the ceramic mixture, but the relative amounts of the two ceramics may be adjusted to achieve thermal expansion and thermal conductivity properties required for a particular application. A mixture of the ceramics and uncured thermosetting polymeric resin is formed, pressed into the shape of the microelectronics base and/or lid, and heated (either concurrently or subsequently) to compress the mixture and cure the polymer.
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