Stratified composite dielectric and method of fabrication
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United States of America Patent
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Aug 31, 1999
Grant Date -
N/A
app pub date -
Oct 14, 1997
filing date -
Oct 14, 1997
priority date (Note) -
Expired
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Abstract
An interconnect platform and its method of fabrication is presented. The interconnect platform of the present invention includes a metal conductor, a dielectric layer, and a buffer layer separating at least one interface between the conductor and the dielectric layer when the buffer has a lower modulus of elasticity than the dielectric layer.
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