Method for wedge bonding using a gold alloy wire
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United States of America Patent
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Aug 31, 1999
Grant Date -
N/A
app pub date -
Jul 28, 1997
filing date -
Jul 31, 1996
priority date (Note) -
Expired
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Abstract
A gold alloy wire for wedge bonding, comprising 1 to 100 parts per million by weight of calcium (Ca), the remainder being gold and inevitable impurities, said gold alloy wire having a tensile strength of not less than 33.0 kg/mm.sup.2 and an elongation of 1 to 3%. The gold alloy wire has a gold purity of not less than 99.9% or further comprises 0.2 to 5.0% by weight of at least one element selected from the group consisting of Pd, Ag and Pt.
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