Importance

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Abstract

A new socket is provided for testing an IC package whereby the contact parts of the contacts are moved outward to be able to conduct attachment and detachment of an IC package without a load, the oxide film formed on the contacts of the IC package is removed to acquire a reliable conductivity, and a stress to deform the contacts of the IC package cannot be exerted. In the socket, the contact parts of the contacts come into contact with the contacts of the IC package while sliding outward (in the opposite direction to the receiving space for the IC package), and remove the oxide films on the surfaces of the IC contacts to secure a reliable conductivity. When the IC package is taken out, the contact parts of the contacts move outward, the supporting point moves inward by the swing of the engaging member; and thereby, the contact parts of the contacts go up virtually vertically in the initial state of the movement, and afterward, move oblique outward to come off from the contacts of the IC package. Thus, the load to the contacts of the IC package can be reduced to so low a level as possible.

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First Claim