Photosensitive resin composition
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United States of America Patent
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Aug 10, 1999
Grant Date -
N/A
app pub date -
Jun 9, 1998
filing date -
Dec 21, 1995
priority date (Note) -
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Abstract
Disclosed herein is a photosensitive resin composition comprising a photopolymerizable monomer, thermoplastic polymeric binder and photoinitiator, wherein said photopolymerizable monomer comprises as least one species of water-soluble monomer and at least one species of water-insoluble monomer, both with two or more unsaturated reactive groups and said reactive groups in total range from 0.5 to 1.5 mole per kg of the solid content when calculated in accordance with the following formula (I): ##EQU1## wherein #M represents the total amount of said reactive group per kg of the solid content of said composition; M.sub.i represents the mole number of a photo-polymerizable monomer i per kg of said composition; Ni represents the number of the reactive groups in a photo-polymerizable monomer i; and k stands for the total number of the photo-polymerizable monomer contained in said composition.
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