Multi-deck power converter module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 3, 1999
Issued Date -
N/A
app pub date -
Sep 22, 1998
filing date -
Feb 21, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-deck power converter module assembly for connection with a substrate (e.g., a host board) having connection regions disposed on its surface includes a second circuit board positioned over a first circuit board, the second circuit board having apertures extending from an upper surface to a lower surface of the second circuit board. At least two rail members are positioned over the second circuit board, each rail member having a first and a second plurality of holes. A pair of spacers are disposed between the first and second circuit boards, each spacer extending through one of the apertures of the second circuit board and received within one of the first plurality of holes of one of the rail members. Terminal pins are attached to the first circuit board, at least one terminal pin extending through the second circuit board and a corresponding one of the second plurality of holes for connection to one of the connection regions on the substrate. Each of the second plurality of holes is sized to allow the rail members to be slidably positioned over the terminal pins during assembly of the power converter module.
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