Single piece integrated package and optical lid
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United States of America Patent
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-
Aug 3, 1999
Grant Date -
N/A
app pub date -
Jul 7, 1997
filing date -
Jul 7, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A lid for protecting and covering an integrated circuit provided in a chip-on-board package is disclosed. The lid has a wall surrounding the integrated circuit, and a top cover covering the integrated circuit, with the wall and top cover provided in a single piece.
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